rb495d 40v, 350ma, smd schottky diode small signal diode ? surface device type mounting ? mositure sensitivity level 1 ? matte tin (sn) lead finishe with nickel (ni) underplate ? pb-free version and rohs compliant ? green compound (halogen free) with suffix "g" on min max min max packing code and prefix "g" on date code. 2.80 3.00 0.110 0.118 1.20 1.40 0.047 0.055 0.30 0.50 0.012 0.020 ? case : sot- 23 small outline plastic package 1.80 2.00 0.071 0.079 2.25 2.55 0.089 0.100 0.90 1.20 0.035 0.047 0.08 0.19 0.003 0.010 ? marking:d3q part no. packing code package packing marking rb495d rf sot-23 3k / 7" reel d3q rb495d rfg sot-23 3k / 7" reel d3q note 2: the suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary despending on application. v junction temperature t j 125 repetitive peak reverse voltage reverse voltage v r 350 ordering information ? high temperature soldering guaranted: 260 /10s ? terminal: matte tin plated, lead free, solderable per mil-std-202, method 208 guranteed note 1: mean output current per element: i o /2. maximum ratings rating at 25c ambient temperature unless otherwise specified. mean forward current non-repetitive peak forward surge current ( note 1) v features mechanical data unit (inch) dimensions suggested pad layou t a 0.022 ref c b d e sot-23 ? epitaxial planar die construction ? weight: 0.008 grams (approximate) unit (mm) 0.550 ref h g f mw type number symbol units value maximum ratings 1.5 -40 ~+125 i fsm 25 v rrm 40 p d 200 power dissipation storage temperature range i o t stg ma a 2.0 0.079 0.95 0.037 0.9 0.035 0.8 0.031 a b c d f e g h 12 3 version : e10
rb495d 40v, 350ma, smd schottky diode small signal diode electrical characteristics reverse breakdown voltage i r = forward voltage i f = i f = reverse leakage current v r = junction capacitance carrier & reel specification dimension(mm) mackin g user direction of feed note 1: a0, b0, and k0 are determined by component size. the clearance between the components and the cavity must be within 0.05 mm min. to 0.5 mm max. the component cannot rote more than 10o within the determined cavity. note 2: if b1 exceeds 4.2 mm(0.165'') for 8 mm embossed tape, the tape may not feed through all tape feeders. embossment center overall tape thickness tape width reel width feed hole width sprocke hole position punch hole position sprocke hole pitch item symbol sprocket hole reel outside diameter carrier depth k 14.4 max. p1 2.00 0.10 t w w1 0.6 max. 8.30 max. type number 100ua 10ma 25v 200ma v c j - v f i r v (br) ua pf 50.0 0.55 v r =0, f=1.0mhz symbol - - 40 - min 178 1 0.32 units max - 70 p0 4.00 0.10 e 13.0 0.5 d2 f 3.50 0.05 v 1.75 0.10 reel inner diameter 2.40 max. d1 50 min. 1.50 +0.10 d a top cover tape carieer tape any additional label (if required) tsc label w1 d1 d2 a version : e10
rb495d 40v, 350ma, smd schottky diode small signal diode rating and characteristic curves macking fig 1 typical forward characteristics 0.01 0.1 1 10 100 1000 0 0.2 0.4 0.6 0.8 forward current (ma) fig 3 admissible power dissipation curve 0 50 100 150 200 250 0 25 50 75 100 125 150 power dissipation (mw) ambient temperature (c) reverse voltage (v) fig 4 typical junction capacitance 0 10 20 30 40 50 60 70 0 5 10 15 20 25 30 35 40 total capacitance (pf) reverse voltage (v) instantanceous forward voltage (v) fig 2 reverse current vs reverse voltage 0.1 1 10 100 1000 0 102030405060708090100 reverse current (na) reverse voltage (v) ta=75 ta=25c ta=25c ta=75c version : e10
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